Robotek

ELECTRICAL AND ELECTRONIC

Electronic and electrical components partially or completely covered in potting/encapsulation processes with one or two component resins such as epoxy, silicone or polyurethane for protection against moisture, dirt, oil or chemicals in the environment, shock and vibration. Potting/encapsulation is performed at atmospheric pressure or under vacuum pressure for void-free production. In potting process, electronic and electrical components are located in a plastic or a metal enclosure and the resin material is poured over it. In encapsulation process, electronic and electrical devices are located in a mold and the resin material poured over it. After releasing from the mould, a resilient cast is created.

Potting applications

Capacitors,
Transformers,
PCB’s,
Cable joints,
Electronic filters,
LED’s,
Power supplies,
Sensors,
Batteries,
Automotive electronic devices
Encapsulation applications
PCB’s,
Cast Transformers CT and VT,
Capacitors,
Connectors,
LED’s